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The 40x80mm Aluminum Water Cooling Block Plate is a high-efficiency liquid thermal management plate designed to dissipate heat rapidly from high-density electronic components. Engineered specifically to fit two side-by-side standard $40\text{mm}\times 40\text{mm}$ TEC1-12706 Peltier modules or large surface area power semiconductors, it serves as the core heat dissipation interface for compact liquid refrigeration systems.

Manufactured using continuous aluminum extrusion with integral braze welding, the block features an internal M-shaped continuous water flow channel. This internal geometry increases fluid contact area and turbulent flow, accelerating thermal absorption away from the flat contact surface. Both ends are fitted with barbed pagoda pipe connectors that securely grip standard flexible water tubing, providing a tight, leak-tested seal for closed-loop liquid cooling rigs.

Key Features and Benefits

• Optimized 40x80mm Surface Area: Perfectly sized to mount up to two $40\text{mm}\times 40\text{mm}$ Peltier TEC modules or large CPU/GPU dies simultaneously.

• High Thermal Conductivity Aluminum: Extruded lightweight aluminum alloy ensures rapid heat absorption and corrosion resistance.

• Internal M-Shaped Flow Path: Built-in internal water channel maximizes fluid surface contact and heat dissipation efficiency.

• Barbed Pagoda Nozzles: $9.5\text{mm}$ outer diameter barbed fittings ensure a tight, leak-proof friction seal with standard $7\text{mm}-8\text{mm}$ ID silicone tubes.

• Leak-Tested Construction: Seamless brazed joint manufacturing eliminates pinhole leaks under standard mini-pump circulation pressures.

• Ultra-Flat Contact Surface: Precision-ground flat contact face ensures maximum conductive contact with thermal paste or silicone thermal pads.

Technical Specifications

Installation & Assembly Guidelines

1. Surface Preparation: Clean the smooth face of the water block and the surface of your peltier module/CPU with isopropyl alcohol.

2. Thermal Interface: Apply a thin, even layer of quality thermal grease/paste (e.g., HY510 or GD900) between the block surface and your heat-generating component.

3. Tubing Connection: Slide $7\text{mm}$ or $8\text{mm}$ inner diameter silicone or PVC tubing over the barbed pagoda nozzles. Secure with small hose clamps or zip ties to prevent accidental slippage under pump pressure.

4. Flow Direction: Connect one nozzle to the output of a $12\text{V}$ mini submersible water pump and the other to the radiator return line.

Applications

• Thermoelectric Cooling (TEC): Cold-side or hot-side water dissipation for DIY mini refrigerators, portable drink coolers, and semiconductor air conditioners using TEC1-12706 modules.

• Computer & Server CPU/GPU Cooling: Compact liquid cooling setups for industrial embedded PCs and custom PC water loops.

• High-Power Electronics: Liquid heat sinking for high-wattage COB LEDs, inverter MOSFETs, and high-current motor drivers.

• Laboratory & Medical Devices: Precise temperature stabilization plates for biological samples and laser diode cooling.

Package Includes

• 1 x 40x80mm Aluminum Water Cooling Block Plate with Dual Pagoda Nozzles

Shipping & Delivery

• Free shipping on orders above ₹999 across India

• Dispatched within 1-3 business days

• Expected delivery: 3-7 business days depending on location

• Secure packaging to ensure safe transit of electronic components